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Printed Electronics Insights: Smart Packaging and IoT

Delegate Type

Event Information

Printed Electronics
Date of Event
12th October 2017
Last Booking Date for this Event
11th October 2017

Attend a day full of presentations and discussions by experts in the field of printed electronics on October 12, in Cambridge (UK).

Together with the OE-A, the EPSRC Centre for Innovative Manufacturing in Large-Area Electronics is organizing “Printed Electronics Insights: Smart Packaging & IoT”, a day of presentations and a panel discussion, co-sponsored by FlexTech. The event will be held on Thursday, October 12, 2017 at Robinson College, Cambridge (UK), with company tours and a networking reception on the day before, together with participants of the 41st OE-A Working Group Meeting (Oct. 11, 2017).

Inspired by a keynote on machine learning by Christopher Williams, Chief Architect for IBM Watson Europe, attendees will learn more on IoT and its application in Smart Packaging in presentations ranging from experiences of packaging companies to the latest innovations from academia.

We are proud to have won Professor Sir Richard Friend, FRS, FREng, as dinner speaker at the networking reception on October 11. Furthermore, you can expect presentations by various renown experts from international companies and research institutes such as PragmatIC, Crown Packaging, VTT and CDT.

OE-A and FlexTech members receive a discount on ticket prices.

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